The Power and Hybrid Business Unit recently introduced a new range of literature including a Capabilities brochure as well as a Multi-Chip Arrays product brochure.

Providing an overview of our technical product manufacturing potential, our new Capabilities brochure expands on the key features and benefits of our packaging solutions as well as providing examples of the applications our products are typically used in.

Our new Multi-Chip Arrays product brochure details the significant advtanges of our unique high density, light weight packages and provides dimensional drawings of our different package types. The extensive range of our standard design examples featured should enable you to identify the circuit layout most applicable for your requirements.