Looking for a custom solution?

Our world-class manufacturing facilities provide the foundation for the development of hybrid microcircuits integrated into the engine controls, fuel management systems and inertial navigation circuitry on some of most well-known global commercial aircraft.

Key Capabilities

  • Turnkey circuit layout and packaging design based on customers’ electrical schematics, and performance and environmental requirements
  • Design and manufacture in compliance with MIL-PRF-38534 Class H
  • Engineering and program management support

State-of-the-Art Facilities

  • Class 10,000 clean room facilities in the US and UK
  • Fully automated SMT lines
  • Fully automated die bonding and wire bonding
  • Automated inspection (under development for wire bonding)
  • Custom test systems including full temperature testing
  • Environmental screening to MIL-STD-883, ESA ECSS-Q-ST-60-05 and BS9450
  • ISO9001:2008 and IS014001:2004 quality management systems applications

Packaging and Technology

  • Hermetic and non-hermetic packaging
  • Multi-layer thick film printing on ceramic (AIO and AIN)
  • High and low temperature co-fi red ceramic (HTCC and LTCC)
  • Thin film
  • Surface mount
  • Bare die and wire bonding (or mixed SMT and With Chip & Wire)

Our diverse range of custom solutions have recently been adopted in the following applications:

• Aircraft engine controls

• Airborne phased array radars

• Aerospace / space inertial measurement units

• Wing ice protection systems

• Electronic counter measures

• Missile fusing / seeker systems

• Helicopter mission computer systems

• Minesweeper sonar systems and beacons

• Suppressor circuits for aircraft lightning protection

• High voltage mass spectrometer circuits

• Optical test instrumentation

• Oil and gas exploration pressure and temperature logging modules

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TT - Welwyn