Lifecycle:
Active (Mature)
Brand:
IRC
Series:
WIN
Series | WIN |
---|---|
Application | Precision |
Mounting | SMD - solder |
Package | Chip 0805 |
Technology | TaN film |
Approval | None |
Example MPN | WINT0805LF031001B3 or WIN-T0805LF-03-1001-B |
Termination Options |
|
Power | 0.25W |
---|---|
Rated Ambient Temperature | 70°C |
De-rate to 0W Ambient Temperature | 150°C |
Max Ambient Temperature | 150°C |
LEV | 100V |
Resistance min | 4.99Ω |
Resistance max | 267kΩ |
Critical Resistance (where applying LEV dissipates Pr) | 40kΩ |
Tolerance | 0.05% |
TCR | 10ppm/°C |
Isolation Voltage of Insulation | Unspecified: ?V |
RoHS Compliant (if Pb-free) | Yes (see below) |
---|---|
RoHS Exemption | None |
China RoHS (if Pb-free) | Compliant |
REACH Status (if Pb-free) | Reviewed to 235 SVHCs (see below) |
CMRT Conflict Mineral Status | Rev 6.22 Next update May 2023 (see below) |
EMRT Extended Mineral Status | CRT Rev 2.2 (see below) |
Termination Finish (if Pb-free) | e3 - Sn matt plated |
Termination Finish (if Pb-bearing) | 60/40 |
How to Specify Pb-Free | Part number has LF after type |
ECCN | EAR99 |
Packing | Plastic tape & reel |
---|---|
Quantity | 3000 |
Nett Weight Each | - |
Reflow Process | J-STD-020E |
MSL | 1 |
Wave Process | Compatible, 260+-5 deg. C, 1 or 2 x 5+-1 seconds contact time |
Shelf-life | None defined, but solderability test prior to use is recommended after two years from date of manufacture |
Launch Date | Nov 2014 |
---|---|
Lifecycle | Active (Mature) |
EOL Date / YTEOL Estimate | 5 years or more. (Reviewed May 23) |
Latest PCN Date | 15 Jul 20 |
Alternative Part Number | - |