| Series | MIL-CHIP |
|---|---|
| Application | High reliability |
| Mounting | SMD - solder |
| Package | Chip 1206 |
| Technology | TaN film |
| Approval | MIL-PRF-55342 |
| Example MPN | D55342H07B1R00S |
| Termination Options | Pb-bearing |
| Power | 0.25W |
|---|---|
| Rated Ambient Temperature | 70°C |
| De-rate to 0W Ambient Temperature | 150°C |
| Max Ambient Temperature | 150°C |
| LEV | 100V |
| Resistance min | 10Ω |
| Resistance max | 500kΩ |
| Critical Resistance (where applying LEV dissipates Pr) | 40kΩ |
| Best Tolerance | 0.1% |
| Best TCR | 25ppm/°C |
| Isolation Voltage of Insulation | Unspecified: ?V |
| RoHS Compliant (if Pb-free) | No |
|---|---|
| RoHS Exemption | - |
| China RoHS (if Pb-free) | Contains Pb. EFUP not established |
| REACH Status (if Pb-free) | See REACH statement pdf (below) |
| CMRT Conflict Mineral Status | See CMRT Excel file (below) |
| EMRT Extended Mineral Status | See EMRT Excel file (below) |
| Termination Finish (if Pb-free) | None |
| Termination Finish (if Pb-bearing) | 60/40 |
| How to Specify Pb-Free | Not available |
| ECCN | EAR99 |
| Packing | Plastic tape & reel |
|---|---|
| Quantity | 500 |
| Nett Weight Each | 0.0162g |
| Reflow Process | J-STD-020E |
| MSL | 1 |
| Wave Process | Compatible, 260+-5 deg. C, 1 or 2 x 5+-1 seconds contact time |
| Shelf-life | None defined, but solderability test prior to use is recommended after two years from date of manufacture |
| Launch Date | Pre-2000 |
|---|---|
| Lifecycle | Obsolete |
| EOL Date / YTEOL Estimate | EOL in Jul 2025 |
| Latest PCN Date | 1 Jul 25 |
| Alternative Part Number | None |