| Series | PFC-D-HT |
|---|---|
| Application | High temperature |
| Mounting | SMD - adhesive |
| Package | Chip 1206 |
| Technology | TaN film |
| Approval | None |
| Example MPN | PFC-D1206HT-02-1001-3301-FB |
| Termination Options | Pb-free |
| Power | 0.1W |
|---|---|
| Rated Ambient Temperature | 150°C |
| De-rate to 0W Ambient Temperature | 200°C |
| Max Ambient Temperature | 200°C |
| LEV | 100V |
| Resistance min | 100Ω |
| Resistance max | 25kΩ |
| Critical Resistance (where applying LEV dissipates Pr) | Out of Range: -Ω |
| Best Tolerance | 0.1% |
| Best TCR | 5ppm/°C |
| Isolation Voltage of Insulation | Unspecified: ?V |
| RoHS Compliant (if Pb-free) | Yes (see below) |
|---|---|
| RoHS Exemption | None |
| China RoHS (if Pb-free) | Compliant |
| REACH Status (if Pb-free) | See REACH statement pdf (below) |
| CMRT Conflict Mineral Status | See CMRT Excel file (below) |
| EMRT Extended Mineral Status | See EMRT Excel file (below) |
| Termination Finish (if Pb-free) | e4 - Au |
| Termination Finish (if Pb-bearing) | Not available |
| How to Specify Pb-Free | All PNs are Pb-free |
| ECCN | EAR99 |
| Packing | Plastic tape & reel |
|---|---|
| Quantity | 1000 |
| Nett Weight Each | - |
| Reflow Process | Not applicable |
| MSL | Not applicable |
| Wave Process | Not applicable |
| Shelf-life | None defined |
| Launch Date | Pre-2000 |
|---|---|
| Lifecycle | Obsolete |
| EOL Date / YTEOL Estimate | EOL in Jul 2025 |
| Latest PCN Date | 1 Jul 25 |
| Alternative Part Number | None |