| Series | PFC-HT |
|---|---|
| Application | High temperature |
| Mounting | SMD - solder |
| Package | Chip 0805 |
| Technology | TaN film |
| Approval | None |
| Example MPN | W0805HTLF-01-1K0F or PFC-W0805HTLF-01-1001-F |
| Termination Options | Pb-free |
| Power | 0.1W |
|---|---|
| Rated Ambient Temperature | 150°C |
| De-rate to 0W Ambient Temperature | 200°C |
| Max Ambient Temperature | 200°C |
| LEV | 50V |
| Resistance min | 10Ω |
| Resistance max | 20kΩ |
| Critical Resistance (where applying LEV dissipates Pr) | Out of Range: -Ω |
| Best Tolerance | 1% |
| Best TCR | 25ppm/°C |
| Isolation Voltage of Insulation | Unspecified: ?V |
| RoHS Compliant (if Pb-free) | Yes (see below) |
|---|---|
| RoHS Exemption | None |
| China RoHS (if Pb-free) | Compliant |
| REACH Status (if Pb-free) | See REACH statement pdf (below) |
| CMRT Conflict Mineral Status | See CMRT Excel file (below) |
| EMRT Extended Mineral Status | See EMRT Excel file (below) |
| Termination Finish (if Pb-free) | e3 - Sn matt plated |
| Termination Finish (if Pb-bearing) | Not available |
| How to Specify Pb-Free | All PNs are Pb-free |
| ECCN | EAR99 |
| Packing | Plastic tape & reel |
|---|---|
| Quantity | 1000 |
| Nett Weight Each | - |
| Reflow Process | J-STD-020E |
| MSL | 1 |
| Wave Process | Compatible, 260+-5 deg. C, 1 or 2 x 5+-1 seconds contact time |
| Shelf-life | None defined, but solderability test prior to use is recommended after two years from date of manufacture |
| Launch Date | 2005 |
|---|---|
| Lifecycle | Obsolete |
| EOL Date / YTEOL Estimate | EOL in Jul 2025 |
| Latest PCN Date | 1 Jul 25 |
| Alternative Part Number | None |