Lifecycle:
Not Recommended for New Designs
Brand:
BI Technologies
Series:
D
| Series | D |
|---|---|
| Application | Network / array |
| Mounting | Through hole |
| Package | Network ceramic |
| Technology | Thick film |
| Approval | None |
| Example MPN | D51C |
| Termination Options | Pb-free |
| Power | 0.2W |
|---|---|
| Rated Ambient Temperature | 25°C |
| De-rate to 0W Ambient Temperature | 80°C |
| Max Ambient Temperature | 80°C |
| LEV | 80V |
| Resistance min | - |
| Resistance max | - |
| Critical Resistance (where applying LEV dissipates Pr) | N/A: -Ω |
| Best Tolerance | - |
| Best TCR | - |
| Isolation Voltage of Insulation | Unspecified: ?V |
| RoHS Compliant (if Pb-free) | Yes (see below) |
|---|---|
| RoHS Exemption | 7(c)-I "Pb in glass" |
| China RoHS (if Pb-free) | Contains Pb. EFUP 50 Years |
| REACH Status (if Pb-free) | See REACH statement pdf (below) |
| CMRT Conflict Mineral Status | See CMRT Excel file (below) |
| EMRT Extended Mineral Status | See EMRT Excel file (below) |
| Termination Finish (if Pb-free) | e1 - SnAgCu |
| Termination Finish (if Pb-bearing) | Not available |
| How to Specify Pb-Free | All standard part numbers are Pb-free |
| ECCN | EAR99 |
| Packing | Bulk / box |
|---|---|
| Quantity | 1000 |
| Nett Weight Each | - |
| Reflow Process | Not applicable |
| MSL | Not applicable |
| Wave Process | Compatible, 260+-5 deg. C, 1 or 2 x 5+-1 seconds contact time |
| Shelf-life | None defined, but solderability test prior to use is recommended after two years from date of manufacture |
| Launch Date | Pre-2000 |
|---|---|
| Lifecycle | Not Recommended for New Designs |
| EOL Date / YTEOL Estimate | 2 years or less. (Reviewed May 25) |
| Latest PCN Date | 22 Jun 22 |
| Alternative Part Number | - |