Lifecycle:
Active (Growth)
Brand:
Welwyn
Series:
TFHP
Series | TFHP |
---|---|
Application | High power |
Mounting | SMD - solder |
Package | Chip 1206 |
Technology | Metal film |
Approval | None |
Example MPN | TFHP1206D-1K54FT5 |
Termination Options | Pb-free |
Power | 2W |
---|---|
Rated Ambient Temperature | 70.000°C |
De-rate to 0W Ambient Temperature | 155°C |
Max Ambient Temperature | 155°C |
LEV | 100V |
Resistance min | 50.000Ω |
Resistance max | 30.1kΩ |
Critical Resistance (where applying LEV dissipates Pr) | 5kΩ |
Best Tolerance | 0.1% |
Best TCR | 25ppm/°C |
Isolation Voltage of Insulation | Unspecified: ?V |
RoHS Compliant (if Pb-free) | Yes (see Certificates) |
---|---|
RoHS Exemption | None |
China RoHS (if Pb-free) | Compliant |
REACH Status (if Pb-free) | See REACH statement pdf (below) |
CMRT Conflict Mineral Status | See CMRT Excel file (below) |
EMRT Extended Mineral Status | No EMRT available |
Termination Finish (if Pb-free) | e3 - Sn matt plated |
Termination Finish (if Pb-bearing) | Not available |
How to Specify Pb-Free | All part numbers are Pb-free |
ECCN | EAR99 |
Packing | Paper tape & reel |
---|---|
Quantity | 5000 |
Nett Weight Each | 0.011g |
Reflow Process | Pre-heat: 30s to 45s at 180°C, Solder: 20s to 40s at 250°C, Peak: 260°C |
MSL | 1 |
Wave Process | Not compatible |
Shelf-life | None defined, but solderability test prior to use is recommended after two years from date of manufacture |
Launch Date | Sep 2022 |
---|---|
Lifecycle | Active (Growth) |
EOL Date / YTEOL Estimate | 5 years or more. (Reviewed May 24) |
Latest PCN Date | No PCNs |
Alternative Part Number | - |