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TFHP1206

Thin Film High Power AlN Chip

Lifecycle:

Active (Growth)

Brand:

Welwyn

Series:

TFHP

Specifications

Series TFHP
Application High power
Mounting SMD - solder
Package Chip 1206
Technology Metal film
Approval None
Example MPN TFHP1206D-1K54FT5
Termination Options Pb-free
Power 2W
Rated Ambient Temperature 70.000°C
De-rate to 0W Ambient Temperature 155°C
Max Ambient Temperature 155°C
LEV 100V
Resistance min 50.000Ω
Resistance max 30.1kΩ
Critical Resistance (where applying LEV dissipates Pr) 5kΩ
Best Tolerance 0.1%
Best TCR 25ppm/°C
Isolation Voltage of Insulation Unspecified: ?V
RoHS Compliant (if Pb-free) Yes (see Certificates)
RoHS Exemption None
China RoHS (if Pb-free) Compliant
REACH Status (if Pb-free) See REACH statement pdf (below)
CMRT Conflict Mineral Status See CMRT Excel file (below)
EMRT Extended Mineral Status No EMRT available
Termination Finish (if Pb-free) e3 - Sn matt plated
Termination Finish (if Pb-bearing) Not available
How to Specify Pb-Free All part numbers are Pb-free
ECCN EAR99
Packing Paper tape & reel
Quantity 5000
Nett Weight Each 0.011g
Reflow Process Pre-heat: 30s to 45s at 180°C, Solder: 20s to 40s at 250°C, Peak: 260°C
MSL 1
Wave Process Not compatible
Shelf-life None defined, but solderability test prior to use is recommended after two years from date of manufacture
Launch Date Sep 2022
Lifecycle Active (Growth)
EOL Date / YTEOL Estimate 5 years or more. (Reviewed May 24)
Latest PCN Date No PCNs
Alternative Part Number -

Resources & Technical Documents

  • All (24)
  • 3D Model (0)
  • End Of Life (0)
  • Product Change Notification (0)
  • Case Study (0)
  • Technical Bulletin (0)
  • Policy & Regulations (0)
  • Terms & Conditions (0)
  • White Paper (0)
  • Datasheet (1)
  • Application Note (8)
  • Brochure (1)
  • Compliance (14)