BCN168

Chip resistor array 1206, 8 element, bussed

Brand:

BI Technologies

Series:

BCN

Lifecycle:

Mature

Specifications

Series BCN
Application Network / array
Mounting SMD - solder
Package Chip array
Technology Thick film
Approval -
Example MPN BCN168RB102J7
Termination Options
  • Pb-free
  • Pb-free, anti-S
Product Brand BI Technologies
Power 0.032W
Rated Ambient Temperature 70°C
De-rate to 0W Ambient Temperature 155°C
Max Ambient Temperature 155°C
LEV 25V
Resistance min 100Ω
Resistance max 1MΩ
Critical Resistance (where applying LEV dissipates Pr) 19.5kΩ
Tolerance 5%
TCR 200ppm/°C
Isolation Voltage of Insulation Unspecified: ?V
RoHS Compliant (if Pb-free) Yes (see below)
RoHS Exemption 7(c)-I "Pb in glass"
China RoHS (if Pb-free) Contains Pb. EFUP 50 Years
REACH Status (if Pb-free) Reviewed to 224 SVHCs (see below)
CMRT Conflict Mineral Status Rev 6.1 Next update May 2022 (see below)
EMRT Extended Mineral Status First issue due Nov 2021
Termination Finish (if Pb-free) e3 - Sn matt plated
Termination Finish (if Pb-bearing) Not available
How to Specify Pb-Free All part numbers are Pb-free
ECCN EAR99
Packing Paper tape & reel
Quantity 5000
Nett Weight Each 7.21mg
Reflow Process J-STD-020E
MSL 1
Wave Process Compatible, 260+-5 deg. C, 1 or 2 x 5+-1 seconds contact time
Shelf-life None defined, but solderability test prior to use is recommended after two years from date of manufacture
Lifecycle Mature
EOL Date / YTEOL Estimate 5 years or more from May 2022
Latest PCN Date 11 Feb 22
Alternative Product -

Resources & Technical Documents

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  • Datasheet (1)
  • Application Note (5)
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