BCN168

Chip resistor array 1206, 8 element, bussed

Lifecycle:

Active (Mature)

Brand:

BI Technologies

Series:

BCN

Specifications

Series BCN
Application Network / array
Mounting SMD - solder
Package Chip array
Technology Thick film
Approval None
Example MPN BCN168RB102J7
Termination Options
  • Pb-free
  • Pb-free, anti-S
Power 0.032W
Rated Ambient Temperature 70°C
De-rate to 0W Ambient Temperature 155°C
Max Ambient Temperature 155°C
LEV 25V
Resistance min 100Ω
Resistance max 1MΩ
Critical Resistance (where applying LEV dissipates Pr) 19.5kΩ
Tolerance 5%
TCR 200ppm/°C
Isolation Voltage of Insulation Unspecified: ?V
RoHS Compliant (if Pb-free) Yes (see below)
RoHS Exemption 7(c)-I "Pb in glass"
China RoHS (if Pb-free) Contains Pb. EFUP 50 Years
REACH Status (if Pb-free) Reviewed to 235 SVHCs (see below)
CMRT Conflict Mineral Status Rev 6.22 Next update May 2023 (see below)
EMRT Extended Mineral Status No EMRT available
Termination Finish (if Pb-free) e3 - Sn matt plated
Termination Finish (if Pb-bearing) Not available
How to Specify Pb-Free All part numbers are Pb-free
ECCN EAR99
Packing Paper tape & reel
Quantity 5000
Nett Weight Each 7.21mg
Reflow Process J-STD-020E
MSL 1
Wave Process Compatible, 260+-5 deg. C, 1 or 2 x 5+-1 seconds contact time
Shelf-life None defined, but solderability test prior to use is recommended after two years from date of manufacture
Launch Date Pre-2000
Lifecycle Active (Mature)
EOL Date / YTEOL Estimate 5 years or more. (Reviewed May 23)
Latest PCN Date 2 Oct 23
Alternative Part Number -

Resources & Technical Documents

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